Description
This position is responsible for: Architecting thermal solutions to address chip energy efficiency and performance scaling, Providing thermal modeling solutions to mobile devices at silicon die and semiconductor package levels, Optimizing advanced IC design scheme/floor-planning to ensure good thermal performance, Developing detailed and reduced-order thermal models, Analyzing simulation and measurement results to enhance product thermal management, Integrate cooling solutions to next generation SOC architecture design.
Minimum Qualifications
Preferred Qualifications
Pay & Benefits
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